PIC16LC73T-04/SS View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC73T-04/SS Datasheet PDF : 288 Pages
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Package Marking Information (Cont’d)
40-Lead PDIP
MMMMMMMMMMMMMM
XXXXXXXXXXXXXXXXXX
AABBCDE
40-Lead CERDIP Windowed
MMMMMMMMM
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
44-Lead PLCC
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
44-Lead MQFP
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
PIC16C7X
Example
PIC16C74-04/P
9512CAA
Example
PIC16C74/JW
AABBCDE
Example
PIC16C74
-10/L
AABBCDE
Example
PIC16C74
-10/PQ
AABBCDE
Legend:
MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Note:
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
© 1997 Microchip Technology Inc.
DS30390E-page 261
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