ST62T03BMC/CCCE View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST62T03BMC/CCCE

8-BIT MCUs WITH A/D CONVERTER, TWO TIMERS, OSCILLATOR SAFEGUARD & SAFE RESET

STMicroelectronics 

ST6200CM-Auto/ ST6201CM-Auto/ST6203CM-Auto

PACKAGE MECHANICAL DATA (Cont’d)

Figure 70. 16-Pin Ceramic Side-Brazed Dual In-Line Package

CDIP16W

mm

inches

Dim.

Min Typ Max Min Typ Max

A

3.78

0.149

A1 0.38

0.015

B 0.36 0.46 0.56 0.014 0.018 0.022

B1 1.14 1.37 1.78 0.045 0.054 0.070

C 0.20 0.25 0.36 0.008 0.010 0.014

D 19.86 20.32 20.78 0.782 0.800 0.818

D1

17.78

0.700

E1 7.04 7.49 7.95 0.277 0.295 0.313

e

2.54

0.100

G 6.35 6.60 6.86 0.250 0.260 0.270

G1 9.47 9.73 9.98 0.373 0.383 0.393

G2

1.02

0.040

L 2.92 3.30 3.81 0.115 0.130 0.150

S

1.27

0.050

Ø

4.22

0.166

Number of Pins

N

16

12.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

SO16

SSOP16

Power dissipation 1)

Maximum junction temperature 2)

Value

90

125

500

150

Unit

°C/W

mW

°C

Notes:

1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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