ST62T03LMC/CCCE View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ST62T03LMC/CCCE
STMicroelectronics
ST62T03LMC/CCCE Datasheet PDF : 96 Pages
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ST6200CM-Auto/ ST6201CM-Auto/ST6203CM-Auto
12.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK® .
■ ECOPACK® packages are qualified according
to the JEDEC STD-020B compliant soldering
profile.
■ Detailed information on the STMicroelectronics
ECOPACK® transition program is available on
www.st.com/stonline/leadfree/, with specific
technical application notes covering the main
technical aspects related to lead-free
conversion (AN2033, AN2034, AN2035,
AN2036).
Compatibility
ECOPACK® LQFP packages are fully compatible
with lead (Pb) containing soldering process (see
application note AN2034).
Table 21. Soldering Compatibility (Wave and Reflow Soldering Process)
Package
SO16
SSOP16
Plating Material Devices
NiPdAu (Nickel-Palladium-Gold)
Sn (pure Tin)
Pb Solder Paste
Yes
Yes
12.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL
Pb-free Solder Paste
Yes
Yes
Table 22. Suggested List of SO16 Socket Types
Package / Probe
Adaptor / Socket Reference
SO16
EMU PROBE
Programming
Adapter
ENPLAS
OTS-16-1.27-04
YAMAICHI
IC51-347.KS-7704
Adapter from SO16 to DIP16 footprint
(delivered with emulator)
Logical Systems PA16SO1-08H-6
Same
Footprint
Socket Type
Open Top
Clamshell
X
SMD to DIP
X
Open Top
Table 23. Suggested List of SSOP16 Socket Types
Package / Probe
Adaptor / Socket Reference
SSOP16
EMU PROBE
Programming
Adapter
ENPLAS
OTS-16-0.65-01
Adapter from SSOP16 to DIP16 footprint
(sales type: ST626X-P/SSOP16)
Logical Systems PA16SS-OT-6
Same
Footprint
Socket Type
Open Top
X
SMD to DIP
X
Open Top
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