ST72260G, ST72262G, ST72264G
13.9 CONTROL PIN CHARACTERISTICS
13.9.1 Asynchronous RESET Pin
TA = -40 to +85°C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
VIL
VIH
Vhys
VOL
Input low level voltage
Input high level voltage
Schmitt trigger voltage hysteresis1)
Output low level voltage 2)
RON Pull-up equivalent resistor
tw(RSTL)out Generated reset pulse duration
th(RSTL)in External reset pulse hold time 4)
tg(RSTL)in Filtered glitch duration 5)
0.85xVDD
VDD=5V
IIO=+5mA
IIO=+2mA
VDD=5V
20
VDD=3V
Internal reset sources
20
2.5
0.68
0.28
40
85
30
200
Figure 99. Typical Application with RESET pin 6)7)8)
Max
0.16xVDD
Unit
V
V
0.95
V
0.45
80
kΩ
µs
µs
ns
Recommended
if LVD is disabled
VDD
VDD
USER
EXTERNAL
RESET
CIRCUIT 5)
0.01µF
4.7kΩ
0.01µF
Required if LVD is disabled
VDD
RON
Filter
PULSE
GENERATOR
ST72XXX
INTERNAL
RESET
WATCHDOG
LVD RESET
Notes:
1. Data based on characterization results, not tested in production.
2. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVSS.
3. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on
RESET pin with a duration below th(RSTL)in can be ignored.
4. The reset network protects the device against parasitic resets.
5. The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the device
can be damaged when the ST7 generates an internal reset (LVD or watchdog).
6. Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go below
the VIL max. level specified in Section 13.9.1 . Otherwise the reset will not be taken into account internally.
7. Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must ensure
that the current sunk on the RESET pin (by an external pull-up for example) is less than the absolute maximum value
specified for IINJ(RESET) in Section 13.2.2 on page 123.
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