ST72F321M7 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72F321M7

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, FIVE TIMERS, SPI, SCI, I2C INTERFACE

STMicroelectronics 

ST72321

13.3 SOLDERING AND GLUEABILITY INFORMATION

Recommended soldering information given only as design guidelines.

Figure 108. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)

250

200

150

Temp. [°C]

100

50

80°C

PREHEATING

PHASE

5 sec

SOLDERING

PHASE

COOLING PHASE

(ROOM TEMPERATURE)

0

Time [sec]

20

40

60

80

100

120

140

160

Figure 109. Recommended Reflow Soldering Oven Profile (MID JEDEC)

250

200

150

Temp. [°C]

100

50

90 sec at 125°C

ramp up

2°C/sec for 50sec

Tmax=235+/-5°C

for 25 sec

150 sec above 183°C

ramp down natural

2°C/sec max

0

100

200

300

Time [sec]

400

Recommended glue for SMD plastic packages dedicated to molding compound with silicone:

s Heraeus: PD945, PD955

s Loctite: 3615, 3298

171/185

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