ST72521AR9TC View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72521AR9TC

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, FIVE TIMERS, SPI, SCI, I2C, CAN INTERFACE

STMicroelectronics 

ST72521

13.2 THERMAL CHARACTERISTICS

Symbol

RthJA

Ratings

Package thermal resistance (junction to ambient)

TQFP80 14x14

TQFP64 14x14

TQFP64 10x10

Value

55

47

50

Unit

°C/W

PD

TJmax

Power dissipation 1)

Maximum junction temperature 2)

500

mW

150

°C

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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