ST7MC2N6T3 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST7MC2N6T3

8-bit MCU with nested interrupts, Flash, 10-bit ADC, brushless motor control, five timers, SPI, LINSCI™

STMicroelectronics 

ST7MC1xx/ST7MC2xx

PACKAGE CHARACTERISTICS (Cont’d)

13.2 THERMAL CHARACTERISTICS

Symbol

RthJA

TJmax

PDmax

Ratings

Package thermal resistance (junction to ambient)

LQFP80 14x14

LQFP64 14x14

LQFP44 10x10

LQFP32 7x7

SDIP32 400mil

SDIP56 600mil

Maximum junction temperature1)

Power dissipation 2)

Notes:

Value

55

55

68

80

63

45

150

500

Unit

°C/W

°C

mW

1. The maximum chip-junction temperature is based on technology characteristics.

2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT

where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on

the ports used in the application.

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