ST7FMC1M2T3 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST7FMC1M2T3

8-bit MCU with nested interrupts, Flash, 10-bit ADC, brushless motor control, five timers, SPI, LINSCI™

STMicroelectronics 

ST7MC1xx/ST7MC2xx

13.3 SOLDERING INFORMATION

In accordance with the RoHS European directive,

all STMicroelectronics packages have been con-

verted to lead-free technology, named ECO-

PACKTM.

■ ECOPACKTM packages are qualified according

to the JEDEC STD-020C compliant soldering

profile.

■ Detailed information on the STMicroelectronics

ECOPACKTM transition program is available on

www.st.com/stonline/leadfree/, with specific

technical Application notes covering the main

technical aspects related to lead-free

conversion (AN2033, AN2034, AN2035,

AN2036).

Backward and forward compatibility:

The main difference between Pb and Pb-free sol-

dering process is the temperature range.

– ECOPACKTM LQFP, SDIP and SO packages

are fully compatible with Lead (Pb) containing

soldering process (see application note AN2034)

– LQFP, SDIP and SO Pb-packages are compati-

ble with Lead-free soldering process, neverthe-

less it's the customer's duty to verify that the Pb-

packages maximum temperature (mentioned on

the Inner box label) is compatible with their Lead-

free soldering temperature.

Table 90. Soldering Compatibility (wave and reflow soldering process)

Package

Plating material devices

Pb solder paste

Pb-free solder paste

SDIP & PDIP

Sn (pure Tin)

Yes

Yes *

LQFP and SO

NiPdAu (Nickel-palladium-Gold)

Yes

Yes *

* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)

is compatible with their Lead-free soldering process.

289/309

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