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STM1404ARNIQ6F View Datasheet(PDF) - STMicroelectronics

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Description
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STM1404ARNIQ6F Datasheet PDF : 35 Pages
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STM1404
6
Maximum ratings
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TSTG
TSLD(1)
Storage temperature (VCC off, VBAT off)
Lead solder temperature for 10 seconds
–55 to 150
°C
260
°C
VIO
Input or output voltage
–0.3 to VCC +0.3
V
VCC/VBAT Supply voltage
–0.3 to 4.5
V
IO
Output current
20
mA
PD
Power dissipation
320
mW
1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C
for between 90 to 150 seconds).
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