STM1817 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STM1817 Datasheet PDF : 25 Pages
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STM1810/1811/1812/1813/1815/1816/1817/1818
4
Maximum rating
Maximum rating
Stressing the device above the rating listed in Table 7 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operating sections of this specification is not
implied. Exposure to Absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
Table 7. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TSTG
TSLD(1)
Storage Temperature (VCC Off)
Lead Solder Temperature for 10 seconds
–55 to 150
°C
260
°C
VIO
Input or Output Voltage
–0.3 to VCC +0.3
V
VCC
Supply Voltage
–0.3 to 7.0
V
IO
Output Current
20
mA
PD
Power Dissipation
320
mW
1. Reflow at peak temperature of 255 °C to 260 °C for < 30 seconds (total thermal budget not to exceed 180 °C
for between 90 to 150 seconds).
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