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STM32F050F4P7 View Datasheet(PDF) - STMicroelectronics

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Description
Manufacturer
STM32F050F4P7 Datasheet PDF : 97 Pages
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STM32F050xx
Electrical characteristics
6.3
Operating conditions
6.3.1 General operating conditions
Table 15. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
fPCLK
VDD
VDDA(1)
VBAT
VIN
PD
TA
TJ
Internal AHB clock frequency
Internal APB clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Must have a potential equal to or
higher than VDD
Backup operating voltage
TC I/O
I/O input voltage
TTa I/O
FT and FTf I/O(2)
BOOT0
LQFP48
Power dissipation at TA = 85 °C UFQFPN32
for suffix 6 or TA = 105 °C for
suffix 7(3)
UFQFPN28
TSSOP20
Ambient temperature for 6
suffix version
Maximum power dissipation
Low power dissipation(4)
Ambient temperature for 7
suffix version
Maximum power dissipation
Low power dissipation(4)
Junction temperature range
6 suffix version
7 suffix version
0
0
2
2
2.4
1.65
–0.3
–0.3
–0.3
0
-
-
-
-
–40
–40
–40
–40
–40
–40
48
48
3.6
3.6
3.6
3.6
VDD+0.3
VDDA+0.3
5.5
5.5
364
526
169
182
85
105
105
125
105
125
MHz
V
V
V
V
mW
°C
°C
°C
1. When the ADC is used, refer to Table 49: ADC characteristics.
2. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.
3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 14: Thermal characteristics).
4. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Table 14:
Thermal characteristics).
Doc ID 023683 Rev 1
39/97

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