STM32F050G4T6 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STM32F050G4T6
STMicroelectronics
STM32F050G4T6 Datasheet PDF : 97 Pages
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STM32F050xx
Package characteristics
Figure 34. UFQFPN32 - 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package outline
Seating plane
C
ddd C
A
A3
D
e
9
8
A1
16
17
E2 b
E
1
32
Pin # 1 ID
R = 0.30
D2
24
L
L
Bottom view
A0B8_ME
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
be connected. It is referred to as pin 0 in Table 8: Pin definitions.
Table 62.
Dim.
UFQFPN32 – 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package
mechanical data
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.5
0.55
0.6
0.0197
0.0217
0.0236
A1
0.00
0.02
0.05
0
0.0008
0.0020
A3
0.152
0.006
b
0.18
0.23
0.28
0.0071
0.0091
0.0110
D
4.90
5.00
5.10
0.1929
0.1969
0.2008
D2
3.50
0.1378
E
4.90
5.00
5.10
0.1929
0.1969
0.2008
E2
3.40
3.50
3.60
0.1339
0.1378
0.1417
e
0.500
0.0197
L
0.30
0.40
0.50
0.0118
0.0157
0.0197
ddd
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 023683 Rev 1
87/97
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