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STPS140AY View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STPS140AY
ST-Microelectronics
STMicroelectronics 
STPS140AY Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Characteristics
STPS140-Y
Figure 7.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Zth(j-c)/Rth(j-c)
1.0
0.9
Epoxy printed circuit board, copper thickness: 35 µm
reccomended pad layout
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
0.0
1E-2
1E-1
tp(s)
1E+0
T
δ=tp/T
1E+1
tp
1E+2
Zth(j-c)/Rth(j-c)
1.0
Epoxy printed circuit board, copper thickness: 35 µm
0.9
reccomended pad layout
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
0.0
1E-2
1E-1
tp(s)
1E+0
1E+1
T
δ=tp/T
1E+2
tp
1E+3
Figure 9.
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
IR(µA)
1E+3
1E+2
1E+1
Tj=125°C
Tj=75°C
C(pF)
200
100
50
F=1MHz
Tj=25°C
1E+0
Tj=25°C
20
1E-1
VR(V)
1E-2
10
0
5
10
15
20
25
30
35
40
1
2
VR(V)
5
10
20
50
Figure 11. Forward voltage drop versus
Figure 12. Thermal resistance junction to
forward current (maximum values)
ambient versus copper surface
under each lead (SMA)
IFM(A)
1E+1
Tj=125°C
Rth(j-a)(°C/W)
140
Epoxy printed circuit board FR4, copper thickness: 35 µm
120
reccomended pad layout
1E+0
100
P=1.5W
80
60
1E-1
40
20
VFM(V)
S(Cu)(cm²)
1E-2
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0
1
2
3
4
5
4/9
Doc ID 17973 Rev 1

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