Characteristics
STPS1L30MF
Figure 7.
Reverse leakage currrent versus
reverse voltage applied (typical
values)
Figure 8.
Reverse leakage currrent versus
junction temperature (typical
values)
IR(mA)
1.E+03
1.E+02
Tj=150°C
Tj=125°C
1.E+01
1.E+00
Tj=100°C
Tj=75°C
Tj=50°C
1.E-01
Tj=25°C
1.E-02
VR(V)
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
IR(mA)
1.E+03
VR=30V
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
0
25
Tj(°C)
50
75
100
125
150
Figure 9.
Junction capacitance versus
reverse voltage applied (typical
values)
Figure 10. Forward voltage drop versus
forward current
C(pF)
1000
100
10
1
VR(V)
10
F=1MHz
VOSC=30mVRMS
Tj=25°C
100
IFM(A)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2 VFM(V)
0.0
0.00 0.05 0.10
Tj=85°C
(maximum values)
Tj=85°C
(typical values)
0.15 0.20 0.25 0.30
Tj=25°C
(maximum values)
0.35 0.40 0.45
0.50
Figure 11.
Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu=35 µm, typical values)
Rth(j-a)(°C/W)
250
200
150
100
50
S(mm²)
0
0
20
40
60
80 100 120 140 160 180 200
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