STPS5L40
Fig. 9-1: Forward voltage drop versus forward
current (low level).
IFM(A)
2.0
1.8
1.6
Tj=125°C
(Maximum values)
1.4
1.2
Tj=125°C
1.0
(Typical values)
0.8
0.6
0.4
0.2
0.0
0.0
0.1
0.2
Tj=25°C
(Maximum values)
VFM(V)
0.3
0.4
0.5
0.6
Fig. 9-2: Forward voltage drop versus forward
current (high level).
IFM(A)
100
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
VFM(V)
1
0.0
0.3
0.5
0.8
1.0
1.3
1.5
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed board FR4, Cu = 35µm).
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
S(cm²)
0
0
1
2
3
4
5
6
7
8
9
10
Fig. 11: Thermal resistances versus leads length.
Rth(°C/W)
80
70
Rth(j-a): Epoxy printed circuit board FR4 (Cu= 35µm)
60
50
40
30
Rth(j-l)
20
10
0
5
Lleads(cm)
10
15
20
25
4/5