TDA1566TH View Datasheet(PDF) - NXP Semiconductors.

Part Name

Description

Manufacturer

TDA1566TH

I²C-bus controlled dual channel 46 W/2Ω, single channel 92 W/1Ωamplifier with load diagnostic features

NXP Semiconductors. 

NXP Semiconductors

TDA1566

I2C-bus controlled dual channel/single channel amplifier

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 24 and 25

Table 24. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

220

Table 25. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

350 to 2000

< 1.6

260

260

1.6 to 2.5

260

250

> 2.5

250

245

> 2000

260

245

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 28.

temperature

maximum peak temperature

= MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 28. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

TDA1566_2

Product data sheet

Rev. 02 — 20 August 2007

© NXP B.V. 2007. All rights reserved.

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