TDA7563BPD(2006) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TDA7563BPD
(Rev.:2006)
(Rev.:2006)
STMicroelectronics
TDA7563BPD Datasheet PDF : 30 Pages
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Package information
10 Package information
TDA7563B
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 32. Flexiwatt27 (horizontal) Mechanical Data & Package Dimensions
DIM.
A
B
C
D
E
F (1)
G
G1
H (2)
H1
H2
H3
L (2)
L1
L2 (2)
L3
L4
L5
L6
M
M1
M2
N
P
R
R1
R2
R3
R4
V
V1
V2
V3
MIN.
4.45
1.80
0.37
0.80
25.75
28.90
21.64
10.15
15.50
7.70
5.15
1.80
2.75
3.20
mm
TYP.
4.50
1.90
1.40
2.00
0.39
1.00
26.00
29.23
17.00
12.80
0.80
22.04
10.5
15.70
7.85
5
5.45
1.95
3.00
4.73
5.61
2.20
3.50
1.70
0.50
0.30
1.25
0.50
MAX. MIN.
4.65 0.175
2.00 0.070
0.42
0.57
1.20
26.25
29.30
0.014
0.031
1.014
1.139
22.44
10.85
15.90
7.95
0.852
0.40
0.610
0.303
5.85 0.203
2.10 0.070
3.50 0.108
3.80 0.126
5˚ (Typ.)
3˚ (Typ.)
20˚ (Typ.)
45˚ (Typ.)
inch
TYP.
0.177
0.074
0.055
0.079
0.015
0.040
1.023
1.150
0.669
0.503
0.031
0.868
0.413
0.618
0.309
0.197
0.214
0.077
0.118
0.186
0.220
0.086
0.138
0.067
0.02
0.12
0.049
0.02
MAX.
0.183
0.079
0.016
0.022
0.047
1.033
1.153
0.883
0.427
0.626
0.313
0.23
0.083
0.138
0.15
(1): dam-bar protusion not included; (2): molding protusion included
OUTLINE AND
MECHANICAL DATA
Flexiwatt27
(Horizontal)
26/30
7399738 A
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