TL054AMFKB View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TL054AMFKB Datasheet PDF : 67 Pages
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www.ti.com
PACKAGE OPTION ADDENDUM
4-Jun-2007
Orderable Device
TL054CDG4
TL054CDR
TL054CDRE4
TL054CDRG4
TL054CN
TL054CNE4
TL054CNSR
TL054CNSRE4
TL054CNSRG4
TL054ID
TL054IDE4
TL054IDG4
TL054IDR
TL054IDRE4
TL054IDRG4
TL054IN
TL054INE4
TL054MFKB
TL054MJ
TL054MJB
Status (1)
ACTIVE
Package
Type
SOIC
Package
Drawing
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
SO
NS
ACTIVE
SO
NS
ACTIVE
SO
NS
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
N
ACTIVE
PDIP
N
OBSOLETE LCCC
FK
OBSOLETE CDIP
J
OBSOLETE CDIP
J
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20
TBD
Call TI
Call TI
14
TBD
Call TI
Call TI
14
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 4
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