TOP242-250
TO-263-7C
.055 (1.40)
.066 (1.68)
.390 (9.91)
.420 (10.67)
.326 (8.28)
.336 (8.53)
.580 (14.73)
.620 (15.75)
.208 (5.28)
Ref.
LD #1
.024 (0.61)
.034 (0.86)
.315 (8.00)
.380 (9.65)
.100 (2.54)
REF
Solder Pad
Dimensions
.638 (16.21)
.128 (3.25)
.050 (1.27)
.038 (0.97)
.245 (6.22)
MIN
.045 (1.14)
.055 (1.40)
.225 (5.72)
MIN
0.68 (1.73)
MIN
.050 (1.27)
.000 (0.00)
.010 (0.25)
.090 (2.29)
-A-
.110 (2.79)
.010 (0.25)
.012 (0.30)
.024 (0.61)
.165 (4.19)
.185 (4.70)
.004 (0.10)
Notes:
1. Package Outline Exclusive of Mold Flash & Metal Burr.
2. Package Outline Inclusive of Plating Thickness.
3. Foot Length Measured at Intercept Point Between
Datum A Lead Surface.
4. Controlling Dimensions are in Inches. Millimeter
Dimensions are shown in Parentheses.
5. Minimum metal to metal spacing at the package body
R07C
for the omitted pin locations is .068 in. (1.73 mm). PI-2664-122004
49 M
12/04