TS4999 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TS4999

Filter-free stereo 2.8 W class D audio power amplifier with selectable 3D sound effects

STMicroelectronics 

TS4999

5

Package mechanical data

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.1

Flip chip package

Figure 62. Flip chip package

2420 μm

750μm

500μm

866μm

866μm

2280 μm

Die size: 2.42x2.28 mm ± 100µm

Die height (including bumps): 600µm

Bumps diameter: 315µm ±50µm

Bump diameter before reflow: 300µm ±10µm

Bumps height: 250µm ±40µm

Die height: 350µm ±20µm

Pitch: 500µm ±50µm

Coplanarity: 50µm max

Optional*: Back coating height: 40µm

40 μm*

600 μm

31/36

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