TIP32C(2006) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TIP32C Datasheet PDF : 8 Pages
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TIP32C
3
Package Mechanical Data
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in
ECOPACK® packages. These packages have a Lead-free second level
interconnect . The category of second level interconnect is marked on the
package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner
box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com
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