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UBA2016AP View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
UBA2016AP Datasheet PDF : 42 Pages
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NXP Semiconductors
12. Package outline
DIP20: plastic dual in-line package; 20 leads (300 mil)
UBA2016A/15/15A
600 V fluorescent lamp driver
SOT146-1
D
L
Z
20
e
b
pin 1 index
1
A2 A
A1
wM
b1
11
ME
c
(e 1)
MH
E
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
0.36 26.92 6.40
0.23 26.54 6.22
2.54
inches
0.17
0.02
0.13
0.068 0.021 0.014 1.060
0.051 0.015 0.009 1.045
0.25
0.24
0.1
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
e1
7.62
0.3
L
3.60
3.05
0.14
0.12
ME
8.25
7.80
0.32
0.31
MH
w
Z (1)
max.
10.0
8.3
0.254
2
0.39
0.33
0.01 0.078
OUTLINE
VERSION
IEC
SOT146-1
REFERENCES
JEDEC
JEITA
MS-001
SC-603
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 21. Package outline SOT146-1 (DIP20)
UBA2016A_15_15A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
37 of 42

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