VNH2SP30 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

VNH2SP30

Automotive fully integrated H-bridge motor driver

STMicroelectronics 

Package and PCB thermal data

4

Package and PCB thermal data

4.1

PowerSSO-30 thermal data

Figure 38. MultiPowerSO-30™ PC board

VNH2SP30-E

Note:

Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB

thickness = 2mm. Cu thickness = 35 µm, Copper areas: from minimum pad layout to

16 cm2).

Figure 39. Chipset configuration

HIGH SIDE

CHIP

HSAB

LOW SIDE

CHIP A

LSA

LOW SIDE

CHIP B

LSB

Figure 40. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition

45

40

35

30

25

20

15

10

5

0

0

R thH S

R thLS

R thH SLS

R thLSLS

5

10

15

20

cm 2 o f C u a re a (re fe r to P C B la yo u t)

26/35

DocID10832 Rev 10

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