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SMC30J6.0CA View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
SMC30J6.0CA
ST-Microelectronics
STMicroelectronics 
SMC30J6.0CA Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
SMC30J
Characteristics
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
1.00 Zth(j-a)/Rth(j-a)
Recommended pad layout
0.10 Single pulse
0.01
1.E-03
epoxy printed board, FR4 copper thickness = 35 µm
1.E-02
1.E-01
1.E+00
1.E+01
tp(s)
1.E+02 1.E+03
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
100 Rth(j-a)(°C/W)
epoxy printed board, FR4 copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
0
SCu(cm2)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 11. Leakage current versus junction temperature (typical values)
1.E+05 IR(nA)
VR = VRM
1.E+04
VRM < 10 V
1.E+03
1.E+02
1.E+01
1.E+00
25
VRM 10 V
50
75
100
Tj(°C)
125
150
Doc ID 022064 Rev 1
5/10

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