CBT3244APW(2005) View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
CBT3244APW Datasheet PDF : 18 Pages
| |||
Philips Semiconductors
CBT3244A
Octal bus switch with quad output enables
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
Table 10: Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
15. Revision history
Table 11: Revision history
Document ID
Release date Data sheet status
Change notice Doc. number Supersedes
CBT3244_2
Modifications:
20050915
Product data sheet
-
9397 750 13362 CBT3244A_1
• The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
• added DHVQFN20 package option (affects Section 2 “Features”, Section 3 “Ordering
information”, Section 5 “Pinning information”, and Section 12 “Package outline”
• Section 2 “Features” on page 1, 6th bullet: changed from ‘exceeds 1000 V HBM ...’ to ‘exceeds
2000 V HBM ...’
• added Section 14 “Abbreviations” on page 16
CBT3244A_1
20040526
Product data sheet
-
9397 750 13281 -
9397 750 13362
Product data sheet
Rev. 02 — 15 September 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
16 of 18
Share Link: 