PIC16LC558-08I/PT View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LC558-08I/PT

EPROM-Based 8-Bit CMOS Microcontrollers

Microchip Technology 

PIC16C55X

10.1 DC Characteristics: PIC16C55X-04 (Commercial, Industrial, Extended)

PIC16C55X-20 (Commercial, Industrial, Extended)

HCS1365-04 (Commercial, Industrial, Extended)

DC Characteristics

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40C  TA  +85C for industrial and

0C  TA  +70C for commercial and

-40C  TA  +125C for extended

Param

No.

Sym

Characteristic

Min Typ† Max Units

Conditions

D001

VDD Supply Voltage

16LC55X 3.0

2.5

— 5.5

5.5

V XT and RC osc configuration

LP osc configuration

D001

D001A

16C55X 3.0

4.5

— 5.5

— 5.5

V XT, RC and LP osc configuration

V HS osc configuration

D002

VDR RAM Data Retention

Voltage(1)

— 1.5* — V Device in SLEEP mode

D003

D004

D010

D010A

VPOR VDD Start Voltage to

ensure Power-on Reset

— VSS

SVDD VDD Rise Rate to ensure 

Power-on Reset

0.05* —

IDD Supply Current(2)

16LC55X — 1.4

— 26

— V See Section 6.4, Power-on Reset for

details

— V/ms See Section 6.4, Power-on Reset for

details

2.5 mA XT and RC osc configuration

Fosc = 2.0 MHz, VDD = 3.0V, WDT

disabled(4)

53 A LP osc configuration

Fosc = 32 kHz, VDD = 3.0V, WDT

disabled

D010

D010A

D013

16C55X —

—

—

1.8 3.3 mA XT and RC osc configuration

FOSC = 4 MHz, VDD = 5.5V, 

WDT disabled(4)

35 70 A LP osc configuration, 

PIC16C55X-04 only

FOSC = 32 kHz, VDD = 4.0V, 

WDT disabled

9.0 20 mA HS osc configuration

FOSC = 20 MHz, VDD = 5.5V, 

WDT disabled

* These parameters are characterized but not tested.

† Data is “Typ” column is at 5V, 25C,unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active Operation mode are: 

OSC1 = external square wave, from rail to rail; all I/O pins configured as input, pulled to VDD,

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins configured as input and tied to VDD or VSS.

4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2REXT (mA) with REXT in k

5: The current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

DS40143E-page 76

Preliminary

 1996-2013 Microchip Technology Inc.

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