DMK2783-000 View Datasheet(PDF) - Alpha Industries

Part Name

Description

Manufacturer

DMK2783-000

GaAs Flip Chip Schottky Diodes

Alpha Industries 

GaAs Flip Chip Schottky Diodes

Suggested Setup Values For WEST-BOND

Model 7200A Epoxy Die Bonder

Materials

Epoxy

Microelectronic grade one component, solvent-free

silver-filled, electrically conductive adhesive — example:

Ablebond 8380 by Ablestick.

Dispense Tube

WEST-BOND B-1831-1 with 9.5 mil I.D., or WEST-BOND

B-1831-2 with 15.5 mil I.D. Other sizes available.

Die Pickup Tool

SPT Part Number 2101-W625-CT-031 x 0.016 x 0.0075.

Hole diameter 0.016" face diameter 0.031", O.D. 0.625".

Use vacuum pressure to pick and place chip.

Adjustment

Bond Force

35 grams at tool.

Dispense Air

30 psi.

Dispense Time

To give diameter of dot required.

Curing Time

Temperature

250°C

130°C

100°C

85°C

Time

10 min.

20 min.

60 min.

120 min.

Flexible Conductive Epoxy Mounting of

Alpha Beamless Flip Chip Diodes – To

Soft or Hard Substrate – As Plated

10 Mil Gap

Conductive Epoxy

Drops (Minimum Amount)

Approximately 8 mil Diameter

1–2 mil height

Deposit Conductive Epoxy

Perform Die Attach

• Flip Device

• Align Bond Pads to Epoxy Dot

(Alignment Marks Help)

• Use Even Pressure to Make Correct Connection

Acceptable

Epoxy Runout

Excessive

Epoxy Runout

Cure Epoxy & DC Continuity Check

• Inspect for Adequate Epoxy Fillet

• Cure According to Mfg. Preferred Schedule.

Typically 110–150°C @ 60 Minutes, or 150°C,

4 Minutes for Snap-Cure Epoxies

Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com

3

Specifications subject to change without notice. 3/00A

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