STPS8H100D(1999) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS8H100D Datasheet PDF : 7 Pages
| |||
STPS8H100D/F/G/G-1
Fig. 6: Junction capacitance versus reverse volt-
age applied (typical values).
C(nF)
1000
500
F=1MHz
Tj=25°C
200
100
1
VR(V)
10
100
Fig. 7: Forward voltage drop versus forward cur-
rent (maximum values).
IFM(A)
50.0
10.0
Tj=125°C
Tj=25°C
1.0
0.1
0
VFM(V)
0.2 0.4 0.6 0.8 1
1.2 1.4 1.6
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm)(D2PAK).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm )
0
0 4 8 12 16 20 24 28 32 36 40
4/7
Share Link: 