M40Z111MH6F(2007) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M40Z111MH6F Datasheet PDF : 21 Pages
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Maximum rating
3
Maximum rating
M40Z111, M40Z111W
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Caution:
Caution:
Table 3. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TA
Ambient operating temperature
Grade 6
–40 to 85
°C
SNAPHAT®
–40 to 85
°C
TSTG
Storage temperature (VCC off)
SOIC
–55 to 125
°C
TSLD(1) Lead solder temperature for 10 seconds
260
°C
VIO
Input or output voltages
–0.3 to VCC +0.3
V
Supply voltage
VCC
M40Z111
–0.3 to 7.0
V
M40Z111W
–0.3 to 4.6
V
IO
Output current
PD
Power dissipation
20
mA
1
W
1. For SO package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260°C (total thermal budget
not to exceed 245°C for greater than 30 seconds).
Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up
mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
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