AD8260ACPZ-RL(Rev0) View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

AD8260ACPZ-RL
(Rev.:Rev0)

High Current Driver Amplifier and Digital VGA/Preamplifier with 3 dB Steps

Analog Devices 

AD8260

OUTLINE DIMENSIONS

5.00

BSC SQ

PIN 1

INDICATOR

TOP

VIEW

1.00 12° MAX

0.85

0.80

SEATING

PLANE

0.80 MAX

0.65 TYP

0.30

0.25

0.18

4.75

BSC SQ

0.60 MAX

0.50

BSC

0.50

0.40

0.30

0.60 MAX

25

24

32 1

EXPOSED

PAD

(BOT TOM VIEW)

17

16

98

PIN 1

INDICATOR

2.85

2.70 SQ

2.55

0.20 MIN

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

3.50 REF

THE EXPOSED PAD IS NOT CONNECTED

INTERNALLY. FOR INCREASED RELIABILITY

OF THE SOLDER JOINTS AND MAXIMUM

THERMAL CAPABILITY IT IS RECOMMENDED

THAT THE PAD BE SOLDERED TO THE

GROUND PLANE. THE GROUND PLANE

PATTERN SHOULD INCLUDE A PATTERN OF

VIAS TO INNER LAYERS.

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

Figure 77. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

AD8260ACPZ-R71 −40°C to +105°C

AD8260ACPZ-RL1 −40°C to +105°C

AD8260ACPZ-WP1 −40°C to +105°C

AD8260-EVALZ1

1 Z = RoHS Compliant Part.

Package Description

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

Evaluation Board

Package Option

CP-32-8

CP-32-8

CP-32-8

©2008 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D07192-0-5/08(0)

Rev. 0 | Page 32 of 32

Share Link: