STP16NF06LFP View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STP16NF06LFP
STMicroelectronics
STP16NF06LFP Datasheet PDF : 9 Pages
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STP16NF06L/FP
THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
Rthj-amb Thermal Resistance Junction-ambient
Max
Tl
Maximum Lead Temperature For Soldering Purpose
TO-220 TO-220FP
3.33
6
62.5
300
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
60
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16V
±100
nA
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 5 V
VGS = 10 V
ID = 8 A
ID = 8 A
Min.
1
Typ.
0.08
0.07
Max.
2.5
0.10
0.09
Unit
V
Ω
Ω
DYNAMIC
Symbol
gfs (*)
Parameter
Forward Transconductance
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS > ID(on) x RDS(on)max,
ID = 8 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
17
345
72
29
Max.
Unit
S
pF
pF
pF
2/9
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