ITG3200 View Datasheet(PDF) - Unspecified

Part Name

Description

Manufacturer

ITG3200

The ITG-3200 triple-axis MEMS gyroscope

Unspecified 

ITG-3200 Product Specification

Document Number: PS-ITG-3200A-00-01.4

Revision: 1.4

Release Date: 03/30/2010

9.7 Soldering Exposed Die Pad

The ITG-3200 has very low active and standby current consumption. The exposed die pad is not required for heat

sinking, and should not be soldered to the PCB since soldering to it contributes to performance changes due to package

thermo-mechanical stress.

9.8 Component Placement

Testing indicates that there are no specific design considerations other than generally accepted industry design practices

for component placement near the ITG-3200 multi-axis gyroscope to prevent noise coupling, and thermo-mechanical

stress.

9.9 PCB Mounting and Cross-Axis Sensitivity

Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in which one

gyro responds to rotation about another axis, for example, the X-axis gyroscope responding to rotation about the Y or Z

axes. The orientation mounting errors are illustrated in the figure below.

Z

Φ

Y

ITG-3200

Θ

X

Package Gyro Axes (

) Relative to PCB Axes (

) with Orientation Errors (Θ and Φ)

The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope’s sensitivity for a given

orientation error.

Cross-Axis Sensitivity vs. Orientation Error

Orientation Error

(θ or Φ)

Cross-Axis Sensitivity

(sinθ or sinΦ)

0º

0%

0.5º

0.87%

1º

1.75%

The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error with respect to the

package.

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