STM32F217REH6V View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STM32F217REH6V Datasheet PDF : 173 Pages
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Package characteristics
STM32F21xxx
Figure 81. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline
C Seating plane
A2
A4
A3
e
A
ddd C
A1 A
F
Ball A1
D
Ball A1
F
E
e
R
15
1
BOTTOM VIEW
1. Drawing is not to scale.
TOP VIEW
A0E7_ME_V2
Table 88. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
A1
0.050
0.080
0.110
0.002
0.0031
0.0043
A2
0.400
0.450
0.500
0.0157
0.0177
0.0197
A3
0.130
0.0051
A4
0.270
0.320
0.370
0.0106
0.0126
0.0146
b
0.230
0.280
0.330
0.0091
0.0110
0.0130
D
9.950
10.000
10.050
0.3740
0.3937
0.3957
E
9.950
10.000
10.050
0.3740
0.3937
0.3957
e
0.600
0.650
0.700
0.0236
0.0256
0.0276
F
0.400
0.450
0.500
0.0157
0.0177
0.0197
ddd
0.080
0.0031
eee
0.150
0.0059
fff
0.080
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
150/173
Doc ID 17050 Rev 8
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