M24512-DFMN6T(2018) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

M24512-DFMN6T
(Rev.:2018)

512-Kbit serial I²C bus EEPROM

STMicroelectronics 

M24512-W M24512-R M24512-DF

Package information

Table 22. WLCSP - 8 bumps, 1.271 x 1.937 mm, 0.5 mm pitch wafer level chip scale

package mechanical data (continued)

ddd

-

-

0.060

-

-

0.0024

eee

-

-

0.060

-

-

0.0024

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Figure 20. WLCSP - 8 bumps, 1.271 x 1.937 mm, 0.5 mm pitch wafer level chip scale

package recommended footprint









1. Dimensions are expressed in millimeters.

EXPSV[‘

&IB)3B9

DS6520 Rev 30

39/47

46

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