LFSC3GA40EP1-7FCN1704I View Datasheet(PDF) - Lattice Semiconductor
Part Name
Description
Manufacturer
LFSC3GA40EP1-7FCN1704I Datasheet PDF : 237 Pages
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LatticeSC/M Family Data Sheet
Revision History
June 2008
Data Sheet DS1004
Date
February 2006
March 2006
Version
01.0
01.1
June 2006
01.2
Section
—
Introduction
Architecture
DC and Switching
Characteristics
Pinout Information
Introduction
Architecture
DC and Switching
Characteristics
Change Summary
Initial release.
SC25 1020 I/O count changed to 476.
Changed ROM 16X4 to ROM 16X2.
Changed “X2 or X4” to “DIV2 or DIV4”.
Added Global Set/Reset Section.
Added notes 5 and 6 to Recommended Operating Conditions table.
Added Power Supply Ramp Rates table.
Removed -5 and -6 speed grades from Typical Building Block Perfor-
mance table.
Added Input Delay Timing table.
Added Synchronous GSR Timing table.
Expanded PROBE_VCC and PROBE_GND description.
Removed A-RXREFCLKP_[L/R] from Signal Description table.
Added RESP_[ULC/URC] to Signal Description table.
Added notes 1 and 2 to Signal Description table.
Changed number of NCs to 28.
Changed number of SERDES (signal + power supply) to 74.
Removed RESP balls from NC list (B2, C2, B29, C29).
Added note to VTT table.
Changed RxRefclk (B2 and C2) to NC.
Added RESP_ULC.
Added RESP_URC.
Changed RxRefclk (B29 and C29) to NC.
Changed SERDES min bandwidth from 622 Mbps to 600 Mbps.
Changed max SERDES bandwidth from 3.4 Gbps to 3.8 Gbps.
Corrected number of package I/Os for the SC80 and SC115 1704 pin
packages.
Updated speed performance for typical functions with ispLEVER 6.0
values.
Changed “When these pins are not used they should be left uncon-
nected.” with “Unused VTT pins should be connected to GND if the
internal or external VCMT function is not used in the bank. If the internal
or external VCMT function for differential input termination is used, the
VTT pins should be unconnected and allowed to float.”
Added “SERDES Power Supply Sequencing Requirements” section.
Changed total bandwidth per quad from 13.6 Gbps to 15.2 Gbps.
Added the accuracy of the temperature-sensing diode to be typically +/-
10 °C. Also referred to a temperature-sensing diode application note for
more information.
Changed “CTAP” to “internal or external VCMT”.
Changed VCC12 parameter to include VDDP, VDDTX and VDDRX.
Changed typical values to match ispLEVER 6.0 Power Calculator.
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7-1
DS 1004 Revision History
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