ESDALC5-1BT2Y View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ESDALC5-1BT2Y
STMicroelectronics
ESDALC5-1BT2Y Datasheet PDF : 12 Pages
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Recommendation on PCB assembly
ESDALC5-1BT2Y
3.5
Reflow profile
Figure 21. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0
30
60
90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
10/12
DocID025820 Rev 1
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