ESDALC14V2-2BP5 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ESDALC14V2-2BP5 Datasheet PDF : 6 Pages
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ESDALC14V2-2BP5 / ESDALC25-2BP5
Figure 7. Footprint dimensions
0.5
4 Ordering information
ct(s) 0.3
rodu ) dimensions in mm
P t(s In order to meet environmental requirements, ST offers these devices in ECOPACK®
te c packages. These packages have a Lead-free second level interconnect . The category of
le u second level interconnect is marked on the package and on the inner box label, in compliance
so rod with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
b P available at: www.st.com.
roduct(s) -- OObsolete 4 Ordering information
lete P uct(s) Part Number
so rod ESDALC14V2-2BP5
OObbsolete P ESDALC25-2BP5
Marking
A3
A4
Package
SOT665
Weight Base qty Delivery mode
2.9 mg
3000
Tape & reel
5 Revision history
Date
08-Dec-2005
Revision
1
First issue
Changes
5/6
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