STM32F051R4U7(2012) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F051R4U7
(Rev.:2012)

Low- and medium-density advanced ARM™-based 32-bit MCU with 16 to 64 Kbytes Flash, timers, ADC, DAC and comm. interfaces

STMicroelectronics 

Package characteristics

Figure 38. UFQFPN32 recommended footprint

STM32F051x

7.2

1. Drawing is not to scale.

2. Dimensions are expressed in millimeters.

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 20: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

● TA max is the maximum ambient temperature in °C,

● ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

100/105

Doc ID 022265 Rev 3

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