A Microchip Technology Company
Pin # 1 Identifier
8 Mbit Firmware Hub
SST49LF008A
Data Sheet
1.05
0.95
0.50
BSC
8.10
0.27
7.90
0.17
12.50
0.15
12.30
0.05
0.70
0.50
14.20
13.80
1.20
max.
DETAIL
0°- 5°
Note:
0.70
0.50
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
1mm
32-tsop-WH-7
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
Figure 30:32-lead Thin Small Outline Package (TSOP) 8mm x 14mm
SST Package Code: WH
©2011 Silicon Storage Technology, Inc.
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