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STM8S003K3(2012) View Datasheet(PDF) - STMicroelectronics

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STM8S003K3 Datasheet PDF : 100 Pages
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Thermal characteristics
STM8S003K3 STM8S003F3
11 Thermal characteristics
The maximum chip junction temperature (TJ max) must never exceed the values given in
Operating conditions.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using
the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
• TAmax is the maximum ambient temperature in °C
• ΘJA is the package junction-to-ambient thermal resistance in °C/W
• PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
• PINTmax is the product of IDD andVDD, expressed in Watts. This is the maximum chip internal
power.
• PI/Omax represents the maximum power dissipation on output pins
Where: PI/Omax =Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and
VOH/IOH of the I/Os at low and high level in the application.
Table 54: Thermal characteristics
Symbol
Parameter(1)
Value
Unit
ΘJA
Thermal resistance junction-ambient
84
TSSOP20 - 4.4 mm
ΘJA
Thermal resistance junction-ambient
90
UFQFPN20 - 3 x 3 mm
°C/W
ΘJA
Thermal resistance junction-ambient
60
LQFP32 - 7 x 7 mm
(1)Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
convection environment.
11.1
11.2
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural convection
(still air). Available from www.jedec.org.
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the order code.
94/100
DocID018576 Rev 3

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