STM8S003K3T6CTR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM8S003K3T6CTR

Value line, 16-MHz STM8S 8-bit MCU, 8-Kbyte Flash memory, 128-byte data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C

STMicroelectronics 

Package information

STM8S003F3 STM8S003K3

10.4

10.4.1

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 19: General operating conditions.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

• TAmax is the maximum ambient temperature in ° C

• ΘJA is the package junction-to-ambient thermal resistance in ° C/W

• PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

• PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

• PI/Omax represents the maximum power dissipation on output pins, where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), and taking account of the actual VOL/IOL and

VOH/IOH of the I/Os at low and high level in the application.

Table 55. Thermal characteristics(1)

Symbol

Parameter

Value

Unit

Thermal resistance junction-ambient

LQFP 32 - 7 x 7 mm

60

ΘJA

Thermal resistance junction-ambient

TSSOP20 - 4.4 mm

84

Thermal resistance junction-ambient

UFQFPN20 -3 x 3 mm

90

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

°C/W

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

96/103

DS7147 Rev 10

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