STM8S105S6T3C View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM8S105S6T3C

Access line, 16 MHz STM8S 8-bit MCU, up to 32 Kbytes Flash, integrated EEPROM,10-bit ADC, timers, UART, SPI, I²C

STMicroelectronics 

STM8S105xx

Package characteristics

Dim.

mm

Min

e

Typ

Max

1.778

inches(1)

Min

Typ

Max

0.0700

eA

10.160

0.4000

eB

12.700

0.5000

L

2.540

3.048

3.810

0.1000

0.1200 0.1500

(1) Values in inches are converted from mm and rounded to 4 decimal digits

11.3

Thermal characteristics

The maximum chip junction temperature (TJ max) must never exceed the values given in

Operating conditions

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using

the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

• TAmax is the maximum ambient temperature in °C

• ΘJA is the package junction-to-ambient thermal resistance in ° C/W

• PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

• PINTmax is the product of IDD andVDD, expressed in Watts. This is the maximum chip internal

power.

• PI/Omax represents the maximum power dissipation on output pinsWhere:PI/Omax =Σ (VOL*IOL)

+ Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low

and high level in the application.

Table 58: Thermal characteristics(1)

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

57

LQFP 48 - 7 x 7 mm

°C/W

ΘJA

Thermal resistance junction-ambient

54

LQFP 44 - 10 x 10 mm

°C/W

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