PIC16LF1503-I/P View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LF1503-I/P

14-Pin Flash, 8-Bit Microcontrollers

Microchip Technology 

PIC16(L)F1503

16-Lead Ultra Thin Quad Flat Pack, No Lead (MV) - 3x3x0.50 mm Body (UQFN)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Notes:

Units

Dimension Limits

Number of Pins

N

Pitch

e

Overall Height

A

Standoff

A1

Terminal Thickness

(A3)

Overall Width

E

Exposed Pad Width

E2

Overall Length

D

Exposed Pad Length

D2

Terminal Width

b

Terminal Length

L

Terminal-to-Exposed-Pad

K

MILLIMETERS

MIN

NOM

MAX

16

0.50 BSC

0.45

0.50

0.55

0.00

0.02

0.05

0.15 REF

3.00 BSC

1.50

1.60

1.70

3.00 BSC

1.50

1.60

1.70

0.20

0.25

0.30

0.25

0.35

0.45

0.20

-

-

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated

3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-211A Sheet 2 of 2

 2011-2015 Microchip Technology Inc.

DS40001607D-page 345

Share Link: