PIC32MX230F128L-I/PF View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC32MX230F128L-I/PF

32-bit Microcontrollers (up to 512 KB Flash and 64 KB SRAM) with Audio/Graphics/Touch (HMI), CAN, USB, and Advanced Analog

Microchip Technology 

PIC32MX1XX/2XX/5XX 64/100-PIN FAMILY

31.1 DC Characteristics

TABLE 31-1: OPERATING MIPS VS. VOLTAGE

Characteristic

VDD Range

(in Volts)(1)

Temp. Range

(in °C)

Max. Frequency

PIC32MX1XX/2XX/5XX 64/100-pin

Family

DC5

Note 1:

VBOR-3.6V

-40°C to +105°C

40 MHz

Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device

Analog modules, such as ADC, etc., will function, but with degraded performance below VDDMIN. Refer to

parameter BO10 in Table 31-10 for BOR values.

TABLE 31-2: THERMAL OPERATING CONDITIONS

Rating

Industrial Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

V-temp Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD – S IOH)

I/O Pin Power Dissipation:

I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))

Maximum Allowed Power Dissipation

Symbol Min. Typical Max. Unit

TJ

-40

—

+125

°C

TA

-40

—

+85

°C

TJ

-40

—

+140

°C

TA

-40

—

+105

°C

PD

PINT + PI/O

W

PDMAX

(TJ – TA)/JA

W

TABLE 31-3: THERMAL PACKAGING CHARACTERISTICS

Characteristics

Symbol Typical Max. Unit Notes

Package Thermal Resistance, 64-pin QFN

JA

28

—

°C/W

1

Package Thermal Resistance, 64-pin TQFP, 10 mm x 10 mm

JA

55

—

°C/W

1

Package Thermal Resistance, 100-pin TQFP, 12 mm x 12 mm

JA

52

—

°C/W

1

Package Thermal Resistance, 100-pin TQFP, 14 mm x 14 mm

JA

50

—

°C/W

1

Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.

DS60001290E-page 310

 2014-2017 Microchip Technology Inc.

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