STM8AP5268TCX View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM8AP5268TCX

Automotive 8-bit MCU, with up to 128 Kbyte Flash, data EEPROM, 10-bit ADC, timers, LIN, CAN, USART, SPI, I2C, 3 to 5.5 V

STMicroelectronics 

STM8AF526x/8x/Ax STM8AF6269/8x/Ax

Package information

11.6

11.6.1

Thermal characteristics

In case the maximum chip junction temperature (TJmax) specified in Table 24: General

operating conditions is exceeded, the functionality of the device cannot be guaranteed.

TJmax, in degrees Celsius, may be calculated using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

where:

TAmax is the maximum ambient temperature in ° C

ΘJA is the package junction-to-ambient thermal resistance in ° C/W

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/Omax represents the maximum power dissipation on output pins

where:

PI/Omax = Σ (VOL * IOL) + Σ((VDD - VOH) * IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low- and high-level in the

application.

Symbol

Table 54. Thermal characteristics(1)

Parameter

Value

Unit

Thermal resistance junction-ambient

LQFP 80 - 14 x 14 mm

38

Thermal resistance junction-ambient

LQFP 64 - 10 x 10 mm

46

ΘJA

Thermal resistance junction-ambient

LQFP 48 - 7 x 7 mm

57

Thermal resistance junction-ambient

LQFP 32 - 7 x 7 mm

59

Thermal resistance junction-ambient

VFQFPN 32 - 5 x 5 mm

25

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

°C/W

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

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