PIC24HJ64GP802-I/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC24HJ64GP802-I/SP Datasheet PDF : 357 Pages
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PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]
with 0.40 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
EXPOSED
D2
PAD
N
TOP VIEW
E
2
1
E2
2
1
NOTE 1
N
BOTTOM VIEW
e
b
K
L
A
A3
A1
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Pins
Pitch
Overall Height
N
28
e
0.65 BSC
A
0.80
0.90
1.00
Standoff
Contact Thickness
Overall Width
A1
0.00
0.02
0.05
A3
0.20 REF
E
6.00 BSC
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
E2
3.65
3.70
4.70
D
6.00 BSC
D2
3.65
3.70
4.70
b
0.23
0.38
0.43
Contact Length
L
0.30
0.40
0.50
Notes:
Contact-to-Exposed Pad
K
0.20
–
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-124B
DS70293D-page 336
Preliminary
© 2009 Microchip Technology Inc.
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