DSPIC33FJ64GP310AT-I/PF View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
DSPIC33FJ64GP310AT-I/PF Datasheet PDF : 322 Pages
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dsPIC33FJXXXGPX06/X08/X10
100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
E
E1
N
b
NOTE 1
123
c
β
NOTE 2
A
φ
A1
L
L1
α
A2
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
100
Lead Pitch
e
0.40 BSC
Overall Height
A
–
–
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
7°
Overall Width
E
14.00 BSC
Overall Length
D
14.00 BSC
Molded Package Width
E1
12.00 BSC
Molded Package Length
D1
12.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.13
0.18
0.23
Mold Draft Angle Top
α
11°
12°
13°
Notes:
Mold Draft Angle Bottom
β
11°
12°
13°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-100B
DS70286C-page 302
© 2009 Microchip Technology Inc.
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