DSPIC33FJ64GP706AI/PF View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

DSPIC33FJ64GP706AI/PF

High-Performance, 16-Bit Digital Signal Controllers

Microchip Technology 

dsPIC33FJXXXGPX06A/X08A/X10A

25.1 DC Characteristics

TABLE 25-1: OPERATING MIPS VS. VOLTAGE

Characteristic

VDD Range

(in Volts)

Temp Range

(in °C)

DC5

3.0-3.6V

3.0-3.6V

-40°C to +85°C

-40°C to +125°C

Max MIPS

dsPIC33FJXXXGPX06A/X08A/X10A

40

40

TABLE 25-2: THERMAL OPERATING CONDITIONS

Rating

dsPIC33FJXXXGPX06A/X08A/X10A

Operating Junction Temperature Range

Operating Ambient Temperature Range

Extended Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD - Σ IOH)

I/O Pin Power Dissipation:

I/O = Σ ({VDD - VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation

Symbol Min

Typ

Max Unit

TJ

-40

—

+125

°C

TA

-40

—

+85

°C

TJ

-40

—

+150

°C

TA

-40

—

+125

°C

PD

PINT + PI/O

W

PDMAX

(TJ - TA)/θJA

W

TABLE 25-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol Typ Max Unit Notes

Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)

θJA

40

—

°C/W

1

Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)

θJA

40

—

°C/W

1

Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)

θJA

40

—

°C/W

1

Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)

θJA

40

—

°C/W

1

Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)

θJA

28

—

°C/W

1

Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.

DS70593C-page 272

© 2011 Microchip Technology Inc.

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