dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 26-10: INTERNAL LPRC ACCURACY
AC
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
CHARACTERISTICS Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Param
No.
Characteristic
Min Typ
HF21
LPRC @ 32.768 kHz (1)
LPRC
-70(2)
—
Note 1: Change of LPRC frequency as VDD changes.
2: Characterized but not tested.
Max Units
Conditions
+70(2) % -40°C ≤ TA ≤ +150°C
TABLE 26-11: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
AC
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
CHARACTERISTICS Operating temperature -40°C ≤TA ≤+150°C for High Temperature
Param
No.
Symbol
Characteristic(1)
Min Typ Max Units
Conditions
HSP35 TscH2doV, SDOx Data Output Valid after
—
10
25
ns
—
TscL2doV SCKx Edge
HSP40 TdiV2scH, Setup Time of SDIx Data Input 28
—
—
ns
—
TdiV2scL to SCKx Edge
HSP41 TscH2diL, Hold Time of SDIx Data Input
35
—
—
ns
—
TscL2diL to SCKx Edge
Note 1: These parameters are characterized but not tested in manufacturing.
TABLE 26-12: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
AC
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
CHARACTERISTICS Operating temperature -40°C ≤TA ≤+150°C for High Temperature
Param
No.
Symbol
Characteristic(1)
Min Typ Max
HSP35 TscH2doV, SDOx Data Output Valid after
—
10
25
TscL2doV SCKx Edge
HSP36 TdoV2sc, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
35
—
—
HSP40 TdiV2scH, Setup Time of SDIx Data Input
28
—
—
TdiV2scL to SCKx Edge
HSP41 TscH2diL, Hold Time of SDIx Data Input
35
—
—
TscL2diL to SCKx Edge
Note 1: These parameters are characterized but not tested in manufacturing.
Units
ns
ns
ns
ns
Conditions
—
—
—
—
© 2011 Microchip Technology Inc.
DS70593C-page 323