DSPIC33FJ32MC304-I/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
DSPIC33FJ32MC304-I/SP
Microchip Technology
DSPIC33FJ32MC304-I/SP Datasheet PDF : 460 Pages
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dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
31.1 DC Characteristics
TABLE 31-1: OPERATING MIPS VS. VOLTAGE
Max MIPS
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
dsPIC33FJ32MC302/304,
dsPIC33FJ64MCX02/X04 and
dsPIC33FJ128MCX02/X04
—
3.0-3.6V(1)
-40°C to +85°C
40
—
3.0-3.6V(1)
-40°C to +125°C
40
Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 31-11
for the minimum and maximum BOR values.
TABLE 31-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Extended Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
I/O Pin Power Dissipation:
I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+155
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
TABLE 31-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 44-pin QFN
θJA
30
—
°C/W
1
Package Thermal Resistance, 44-pin TFQP
θJA
40
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
θJA
45
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θJA
50
—
°C/W
1
Package Thermal Resistance, 28-pin QFN-S
θJA
30
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
DS70291G-page 358
© 2007-2012 Microchip Technology Inc.
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